Server: Netscape-Communications/1.1b1 Date: Friday, 21-Nov-97 05:03:48 GMT Last-modified: Monday, 18-Aug-97 18:41:42 GMT Content-length: 4164 Content-type: text/html
HEI provides world-class microelectronics packaging solutions using today's most advanced hybrid thickfilm and multichip module technology. We have consistently designed and manufactured ultra-miniature, high reliability circuitry that is used within the Medical, Computer, Telecommunications and Industrial markets.
Cost-Efficient Benefits
Our advanced thick film technology approaches thin film line resolution at a fraction of the cost. Reduced size and shorter signal lines increase circuit speed, reduce power consumption and enhance performance in high frequency applications. Additional precision thick film printing of resistors within the circuit aid in reducing circuit size often by a factor of 5 or more when compared to standard printed circuit board technology.
HEI ultra-miniature circuits of ceramic or other substrate materials also possess excellent thermal dissipation properties. Direct die bonding reduces the number of interconnects thereby increasing the overall reliability of the circuit.
Advanced Packaging
HEI offers a full range of microelectronic packaging options. The ultraminiature technology that achieves higher packaging density includes:
Facility and Equipment
HEI maintains a 45,000 square feet of manufacturing and engineering facility in Victoria, Minnesota.. The facility includes two Class 10,000 clean room controlled environments for precision thick film screen printing and manufacturing operations. Equipment includes an in-line aqueous cleaning system, multiple automated pick and place work cells, gold thermosonic wire bonders, aluminum ultrasonic wedge bonders, and nitrogen atmosphere reflow furnaces and X-ray inspections systems.
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